VLP ED Foil
VLP or very low profile electrolytic copper foil has the characteristics of low roughness and high peel strength. The electrolysis processed copper foil has the advantages of great purity and low impurity content, as well as having a smooth surface, flat board shape, and large width. After roughening one side, the laminated electrolytic copper foil can be bonded with other materials, and it is not easy to peel off.
Properties of VLP ED Foil
Classification | Unit | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
Cu Content | % | ≥99.8 | ||||||
Area Weight | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
Tensile Strength | R.T.(23℃) | Kg/mm2 | ≥28 | |||||
H.T.(180℃) | ≥15 | ≥18 | ≥20 | |||||
Elongation | R.T.(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
H.T.(180℃) | ≥6.0 | ≥8.0 | ||||||
Roughness | Shiny(Ra) | μm | ≤0.43 | |||||
Matte(Rz) | ≤3.5 | |||||||
Peel Strength | R.T.(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
Change of color(E-1.0hr/200℃) | % | Good | ||||||
Solder Floating 290℃ | Sec. | ≥20 | ||||||
Appearance(Spot and copper powder) | ---- | None | ||||||
Pinhole | EA | Zero | ||||||
Size Tolerance | Width | mm | 0~2mm | |||||
Length | mm | ---- | ||||||
Core | Mm/inch | Inside Diameter 79mm/3 inch | ||||||
