C1990 Titanium-copper Foil
Titanium copper is a copper alloy having titanium as the main additive element. Advantages include high strength, along with excellent stress relaxation resistance and bend formability. Its properties are superior to those of beryllium copper alloy, long a representative standard for high-functionality copper alloys. Among the main uses are for connectors and camera modules in electronic devices such as smartphones and personal computers, taking advantage of the high strength and workability. Thanks to its outstanding stress relaxation resistance, use in automotive connectors has grown in recent years.
Features of C1990 Titanium-copper Foil
Excellent spring properties
High thickness precision
High reliability
Excellent stress relaxation resistance
Excellent fatigue properties
Full-process production for quick delivery
Properties of C1990 Titanium-copper Foil
| Standard composition | Ti: 2.90~3.50 | Cu+Ti ≥ 99.5 |
|---|---|---|
| Electrical conductivity | 10 | %IACS (@20℃) |
| Specific resistance | 172 | nΩ·m (@20℃) |
| Thermal conductivity | 47 | W/mK |
| Linear expansion coefficient | 18.6 | ×10-6/K (20 to 300℃) |
| Modulus of elasticity | 115-127 | GPa |
| Density | 8.70 | g/cm3 |
