HVLP Copper Foil
Hyper Very Low Profile (HVLP) copper foil has found extensive applications in high-speed and high-frequency circuit boards. It boasts an extremely low surface roughness and a surface profile structure that is even lower than conventional copper foil. This reduces signal loss and attenuation during high-speed transmission and ensures excellent circuit etching properties
Properties of HVLP Copper Foil
Classification
| Unit | Requirement | Test Method | ||||||||
| Foil Designation | / | 1 | H | M | 1 | IPC-4562A | |||||
| Nominal thickness | / | 10um | 12um | 1/2 OZ (18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A | ||||
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 | IPC-TM-650 2.2.12.2 | ||||
| Purity | ％ | ≥99.8 | IPC-TM-650 2.3.15 | ||||||||
| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | IPC-TM-650 2.3.17 | |||
| Matte side(Rz) | um | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | |||||
| Tensile Strength | R.T.(23℃) | Mpa | ≥300 | ≥300 | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.3.18 | |||
| H.T.(180℃) | Mpa | ≥200 | ≥200 | ≥200 | ≥200 | ≥200 | |||||
| Elongation | R.T.(23℃) | ％ | ≥4 | ≥5 | ≥6 | ≥8 | ≥10 | IPC-TM-650 2.3.18 | |||
| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 | |||||
| Peel Strength(FR-4) | N/mm | ≥0.8 | IPC-TM-650 2.4.8 | ||||||||
| Ibs/in | ≥4.6 | ||||||||||
| Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 | ||||||||
| Anti-oxidization | R.T.(23℃) | 180days | / | ||||||||
| H.T.(200℃) | 60 Minutes | / | |||||||||
