Oxygen-free Copper Foil For IGBT Liquid Cold Plates

Oxygen-free Copper Foils for IGBT Liquid Cold Plates is another IGBT Liquid Cold Plates thermal management solution aimed at efficiently cooling components and entire systems. They efficiently manage the heat generated in high-power electronics, machines and other heat-sensitive devices.

And that is because of the superior thermal conductivity of oxygen-free copper foil. Cold plates can absorb heat from a heat-generating source and transfer that heat to a coolant, liquid or gas, which is a thermal management solution for heat carry. Oxygen-free copper foils are used in electronics, high-performance computing, renewable energy, aerospace, and defence.