HTE Copper Foil
HTE, or high temperature and elongation, copper foil very easily and very effectively withstands high temperature and high ductility. When heated, the copper foil stays unoxidized and uncoloured, and its ductility provides for simple interlamination with other materials. The electrolytic process used to manufacture the copper foil provides for a very clean surface and flat sheet-shaped copper foil. The copper foil has a roughened side, which provides for easier adhesion to other materials. The copper foil has very high overall purity and very high thermal and electrical conductivity. To satisfy our customers and their needs, we provide not only rolls of copper foil but also tailored cutting foil to their specifications.
Features of HTE Copper Foil
It possesses good high-temperature tensile and elongation properties, excellent heat resistance, etchability, and oxidation resistance.
Prosperities of HTE Copper Foil
Classification | Unit | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
Cu Content | % | ≥99.8 | ||||||
Area Weight | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
Tensile Strength | R.T.(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
H.T.(180℃) | ≥15 | |||||||
Elongation | R.T.(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
H.T.(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
Roughness | Shiny(Ra) | μm | ≤0.4 | |||||
Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
Peel Strength | R.T.(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
Change of color(E-1.0hr/190℃) | % | Good | ||||||
Solder Floating 290℃ | Sec. | ≥20 | ||||||
Pinhole | EA | Zero | ||||||
Preperg | ---- | FR-4 | ||||||
