C10100 Copper Foil For CPU
The purity of C10100 copper foil reaches 99.99%, the oxygen content is not more than 0.003%, and the total impurity content is not more than 0.03%.C10100 achieves a minimum 101% IACS conductivity rating. This copper is finished to a final form in a carefully regulated, oxygen-free environment. C10100 copper foil for CPU has high ductility, high electrical and thermal conductivity and low volatility under high vacuum, excellent cold and hot processing performance, and good forgeability.
Properties Of C10100 Copper Foil For CPU
| Tensile Strength | 50ksi |
| Yield Strength | 45ksi |
| Elongation at Break | 12% |
| Density | 8.92 g/cm³ |
| Melting Point | 1083 °C |
| Thermal Expansion | 16.9 x10^-6 /K |
| Thermal Conductivity | 391.1 W/m.K |
| Finish | Mill Finish, Polished, Satin finish, Bright, Brush |
