WCu Packaging Substrate

The key advantage of the WCU packaging substrate lies in the physical properties of its material. Tungsten-copper alloy is a two-phase pseudo-alloy with tungsten as the base and copper as the auxiliary component. This composite material combines the low coefficient of thermal expansion of tungsten with the high thermal conductivity of copper. Its coefficient of thermal expansion and thermal and electrical conductivity can be designed by adjusting the composition ratio, thus achieving good matching with different chip or substrate materials. This allows WCU material to effectively cope with thermal stress caused by temperature changes, while efficiently conducting the heat generated during device operation, ensuring stability under high loads. In the packaging structure, the WCU substrate mainly serves as a heat sink (heat sink) and supporting substrate. Mounted on the substrate, it provides a critical heat dissipation channel for high-power devices such as IGBT modules, RF power amplifiers, and LED chips, stabilizing their operating temperature. In addition, it is also suitable for manufacturing high-performance lead frames, thermal control boards, and heat sinks.