WCu Electronic Packaging Sheet

The WCu electronic packaging sheet is a key electronic packaging component made of tungsten-copper composite material, primarily used for thermal management in high-power electronic devices. The coefficient of thermal expansion and thermal and electrical conductivity of WCu material can be precisely designed by adjusting the ratio of tungsten to copper, allowing it to be well-matched with various materials (such as stainless steel, Kovar, silicon, gallium arsenide, and alumina) to meet different packaging requirements. Its core value lies in effectively solving the heat dissipation and thermal stress matching challenges brought about by the miniaturization and high integration of electronic components by combining the low coefficient of thermal expansion of tungsten and the high thermal conductivity of copper.