Our ultra-thin copper alloy VC heat spreaders deliver a unique thermal solution designed for ultra-efficient heat dissipation in high-power electronics. Made from phosphor bronze alloy substrates, these hermetically sealed cavities have integrated micro-grooved wick structures and use deionised water working fluid (≥18 MΩ·cm), which allows for added heat removal.

By leveraging phase-change heat transfer, the spreaders achieve rapid thermal diffusion and a heat dissipation efficiency that is nearly 300% greater than conventional cooling solutions. This product is well-tailored for use in 5G communication devices, high-performance laptops, and industrial control systems. It meets the heat dissipation needs of high-density heat sources and provides reliable thermal management for the stable operation of the electronics.

Features Of Ultra-thin Copper Alloy VC Heat Spreader

Exceptional Thermal Conductivity: Exceeds the thermal conductivity of pure copper by more than 20 times.

No Hot Spots: Surface temperature uniformity is within 3℃.

Surface Adaptability: A Flexible surface can accommodate irregular heat sources, such as curved screens.

Designed for You: Tailored design services offered for specific dimensions and configurations.

Applications Of Ultra-thin Copper Alloy VC Heat Spreader

Entertainment Products: smartphones and tablets/laptops, and AR/VR devices

Telecommunication Equipment: 5G equipment, like base stations and routers 

Automotive Electronics: on-board charger, autonomous driving chips  

Medical Devices: imaging devices and therapy laser devices