Tungsten-copper Packaging Substrate

Tungsten-copper packaging substrates are key components using tungsten-copper alloys as the core material, serving to support, protect, connect, and dissipate heat from electronic components. By combining the high melting point and hardness of tungsten with the high electrical and thermal conductivity of copper, they have become an important solution in modern electronic packaging. Common tungsten-copper packaging materials come in different grades, each corresponding to different performance characteristics. As electronic products develop towards miniaturization and high performance, the requirements for heat dissipation efficiency and reliability of packaging substrates are increasing. Through composition optimization (such as adjusting the tungsten-copper ratio) and process improvements (such as using ultrafine powder preparation technology), the thermal conductivity and other properties of tungsten-copper materials are expected to be further improved.