Tungsten-copper Heatsink Packaging Sheet

Tungsten-copper alloys are manufactured using processes such as powder metallurgy. Their coefficient of thermal expansion (CTE) and thermal conductivity can be precisely controlled by adjusting the ratio of tungsten to copper. Tungsten-copper heatsink packages are key packaging materials for thermal management in electronic devices. Their core is made of a tungsten-copper alloy, combining the high melting point and low CTE of tungsten with the high thermal and electrical conductivity of copper to achieve excellent heat dissipation performance and structural stability. This allows the material to match the CTE of semiconductor materials such as silicon and gallium arsenide, or ceramic and metal substrates, effectively reducing thermal stress and preventing cracking or desoldering during drastic temperature changes. Simultaneously, its high thermal conductivity rapidly dissipates heat generated by core components (such as CPUs, GPUs, and high-power lasers).