Tungsten-copper Electronic Packaging Substrate

Tungsten-copper electronic packaging substrates are high-performance composite materials composed of tungsten and copper, combining the low coefficient of thermal expansion and high melting point of tungsten with the high thermal and electrical conductivities of copper. By adjusting the tungsten-to-copper ratio (e.g., common models like CUW70 and 85W15Cu), the coefficient of thermal expansion and thermal and electrical conductivities of this material can be precisely tailored to meet the matching requirements of different electronic packaging scenarios. It is used as a substrate, bottom electrode, or heat sink for packaging high-power integrated circuits, high-frequency microwave devices, 5G communication base stations, radar modules, and high-power lasers.