Tungsten Copper Electronic Packaging Chip
The composition of the alloy can be adjusted so that the thermal expansion coefficient and thermal conductivity of the W-Cu alloy match the chip's thermal expansion coefficient. Furthermore, the alloy's surface roughness and flatness can greatly influence the quality of the chip. As a rule of thumb, the better the alloy's appearance quality, the more advantageous it is to the enhancement of chip performance.
Specifications of Tungsten Copper Electronic Packaging Chip
Tungsten Copper Alloy Packaging Chip | |||||
Item | Material | Production Process | Sintering Temperature | Mold | Custom |
Electronic wind film | Tungsten copper alloy | Metal Injection Moulding | 1650°C | To be customised | Yes |
Chemical composition | Alloy grade | Cu | W | Total amount of impurity elements | |
WCu10 | 10+/-2 | Moargin | ≤0.1 | ||
WCu15 | 15+/-3 | Moargin | ≤0.1 | ||
WCu20 | 20+/-3 | Moargin | ≤0.1 | ||
WCu25 | 25+/-3 | Moargin | ≤0.1 | ||
WCu40 | 40+/-5 | Moargin | ≤0.1 | ||
