Tungsten-copper Alloy Square Plates are high-performance composite materials consisting of tungsten and copper, including tungsten-copper alloy plates manufactured via powder metallurgy processes (powder mixing and copper infiltration). They incorporate the vast electrical and thermal conductivity of copper, in addition to the high melting point and extreme hardness of tungsten. The alloy density lies between 15.0 and 11.8 g/cm3, and the copper-tungsten ratio (CuW50, CuW55, CuW70, etc.) can be modified to optimize properties. Each grade of tungsten-copper square plates ascertains varying density, resistivity, conductivity, and hardness.

Key Application Areas

Electrode materials: Applicable in electrical discharge machining (EDM) and resistance welding, owing to precision in processing and resistance to arc erosion. This makes them viable in mold manufacturing and welding of automotive components.

Contact materials: Used in the construction of high-voltage switches, circuit breakers, and vacuum discharge tubes to provide uninterrupted switching of the circuit even with high currents.

Electronic Packaging: Serves as a heat-dissipating substrate or conductive pathway. Its thermal expansion coefficient matches that of the semiconductor materials utilized in the device. Thus, the reliability of the device is enhanced.

Aerospace and Defense: Used in missile components, rocket nozzles, and other applications that require high resistance to temperature and corrosion.