NiCu Alloy Sputtering Target

Nickel-copper alloys, or Monel, contain around 67% nickel and 30% copper. These alloys possess an unusual combination of corrosion resistance, mechanical strength, and medicinal resistance. They are, therefore, suited for use in many industries, such as marine, chemical, and oil and gas. For modern sputtering deposition systems, the Nickel Copper (Ni/Cu) Sputtering Target is designed for optimum quality and utility. Owing to the target's high purity (≥99%) and quality control during production, consistent film deposition is achieved. With compatible bonding materials such as indium and bottom elastomer, the target is a useful element in thin film deposition systems. The Nickel Copper (NiCu) Allied Sputtering Target has a fine appearance. It is silver white, has a fine metallic polish, and demonstrates a nice combination of appearance and functionality.

Properties Of NiCu Alloy Sputtering Target

Compound FormulaCuNi
Molecular Weight122.239 g/mol
AppearanceMetallic solid in various forms   (plate, bar, sheet, strip, powder, foil)
Melting Point2031-2255 °F
Boiling PointN/A
Density8.5-8.95 g/cm3
Solubility in H2ON/A
Electrical Resistivity3.8 x 10-8 Ω·m
Heat of Fusion220-240 kJ/kg
Poisson's Ratio0.34-0.35
Tensile Strength267-624 MPa
Thermal Expansion16-17 W/m·K
Young's Modulus120-126
Exact Mass120.865 g/mol
Monoisotopic Mass120.865 g/mol

NiCu Alloy Sputtering Target

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