NiCu Alloy Sputtering Target
Nickel-copper alloys, or Monel, contain around 67% nickel and 30% copper. These alloys possess an unusual combination of corrosion resistance, mechanical strength, and medicinal resistance. They are, therefore, suited for use in many industries, such as marine, chemical, and oil and gas. For modern sputtering deposition systems, the Nickel Copper (Ni/Cu) Sputtering Target is designed for optimum quality and utility. Owing to the target's high purity (≥99%) and quality control during production, consistent film deposition is achieved. With compatible bonding materials such as indium and bottom elastomer, the target is a useful element in thin film deposition systems. The Nickel Copper (NiCu) Allied Sputtering Target has a fine appearance. It is silver white, has a fine metallic polish, and demonstrates a nice combination of appearance and functionality.
Properties Of NiCu Alloy Sputtering Target
| Compound Formula | CuNi |
| Molecular Weight | 122.239 g/mol |
| Appearance | Metallic solid in various forms (plate, bar, sheet, strip, powder, foil) |
| Melting Point | 2031-2255 °F |
| Boiling Point | N/A |
| Density | 8.5-8.95 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 3.8 x 10-8 Ω·m |
| Heat of Fusion | 220-240 kJ/kg |
| Poisson's Ratio | 0.34-0.35 |
| Tensile Strength | 267-624 MPa |
| Thermal Expansion | 16-17 W/m·K |
| Young's Modulus | 120-126 |
| Exact Mass | 120.865 g/mol |
| Monoisotopic Mass | 120.865 g/mol |
