As a result of the combined processing of molybdenum and copper-based materials, the molybdenum copper substrate becomes a composite heat dissipation component with significant performance capacity. It has high absorption with nearly isotropic thermal expansion for heat dissipation and seamless thermal expansion with a heat source, and it withstands excellent corrosion. It is used in the heat dissipation of high-power electronic components and devices, for instance, very reactive and powerful components like electronic IGBTs, FETs, and ultra-fast diodes. In addition, the substrate is used in the aerospace, national defense, and communication equipment industry, metal packaging, and various other applications.

All in all, the molybdenum copper substrate is a heat dissipation component with unmatched thermal conductivity performance and withstands high corrosion, in addition to having seamless thermal expansion, for the thermal heat dissipation of components and devices that practice high electronic power.

Properties Of Molybdenum Copper Substrate