Molybdenum-copper Alloy Strip

Molybdenum-copper alloy (Mo/Cu) has a wide range of applications, possessing the excellent properties of both molybdenum and copper, and is widely used in various fields. Mo/Cu alloy is a pseudo-alloy material composed of body-centred cubic molybdenum and face-centred cubic copper, which are immiscible and maintain relative independence in composition. It not only possesses the high strength and low coefficient of thermal expansion of molybdenum but also the excellent electrical and thermal conductivity of copper.

By adjusting the ratio of copper to molybdenum, Mo/Cu materials with different coefficients of thermal expansion and electrical and thermal conductivity can be produced. Using high-quality molybdenum powder and oxygen-free copper powder as raw materials, ensuring product purity and accurate proportions, and through isostatic pressing followed by high-temperature sintering and copper infiltration, a product with fine structure, excellent performance, good arc-breaking performance, good electrical and thermal conductivity, and low thermal expansion can be obtained. It can be well matched and sealed with materials such as silicon substrates and gallium arsenide in electronic devices, avoiding thermal stress-induced fatigue failure. Furthermore, due to its good thermal conductivity, it is widely used in electronic packaging, heat sink materials, and some high-power basic current modules. In addition, molybdenum-copper composite materials are key materials in industries such as microwave, communications, radio frequency, aerospace, electronics, and high-power lasers, and are the foundation for the development and production of high-end electronic products. It is also a high-end packaging material.