Molybdenum copper packages are composite sheets consisting of molybdenum (Mo) and copper (Cu) created in alloy proportions typically produced by powder metallurgy. Such alloys are necessary and critical in industries B and C due to the unique attributes of molybdenum and copper. In addition to the importance of molybdenum-copper sheets to the packages of integrated circuits, they are also necessary for packages of other devices, such as power semiconductors and high-frequency microwave devices. The molybdenum-copper alloy sheet’s unique ability to balance high thermal conductivity with low thermal expansion assists in preventing excessive heat and loss of control from high-power and frequency devices during operation and active devices from failing.

Properties Of Molybdenum Copper Package Sheet