CuNi3SiMg Copper Alloy Foil Strip
The CuNi3SiMg Copper Alloy Foil Strip is a highly developed alloy of copper, nickel, and silicon, which is capable of hardening with precipitation of NiSi during a specially controlled heat treatment, along with cold working. It has remarkable bendability and is strong, hot, and cold formable, and has good corrosion resistance. The NiSi interleavings provide great relaxation properties, even getting to 150ºC. With a tin coating, the alloy has heat and 150ºC for 3,000 hours without tin peeling. CuNi3Si is also easy to weld, solder, and braze, and has good electrical and thermal conductivity.
Applications Of CuNi3SiMg Copper Alloy Foil Strip
Electrical connectors
Spring contacts
Lead frames for semiconductor devices
Switches and relays
Terminals
Automotive electrical components
Properties Of CuNi3SiMg Copper Alloy Foil Strip
Chemical Composition | Ni: 2.2-4.2 Si: 0.25-1.2 Mg: 0.05-0.3 Cu: Balance |
Density (g/cm3) | 8.82 |
Coefficient of Thermal Expansion (10-6/K) | 17.3 |
Thermal Conductivity, W/(m·K) | 190 |
Annealing (%IACS) 20℃ | ≧40 |
Thickness Vickers Hardness | 180 - 260 |
Elonggation% | ≥5 - 10 |
