CuNi1P Alloy Plate

CuNi1P Alloy Plate is age-hardenable for strength but retains good electrical/thermal properties with good formability. CuNi1P alloy plate, a classic Cu-Ni-P ternary elastic material, combines high conductivity with ultra-high fatigue life. After cold rolling, it has a tensile strength of 650 MPa and an elastic modulus of 140 GPa, while maintaining 50% IACS conductivity and a stable springback angle of ±1°. Phosphorus microcrystal precipitation forms a hard mesh, which is three times more resistant to abrasive wear than beryllium copper, yet it is non-toxic and environmentally friendly. Available in a full range of thicknesses from 0.08-2.0 mm, with a surface Ra≤0.3 μm, it is suitable for high-speed etching and laser micro-cutting. Used in 5G high-speed connectors, relay springs, and battery busbars, it has a connection life of over 1 million cycles, making it the preferred current-carrying spring plate for miniaturized, highly reliable electronic circuits.