Cu/Zn alloy sputtering is an example of composite technology utilized to deposit thin films of copper and zinc in the fields of electronics, optics, and photovoltaics. The attributes of alloyed copper and zinc involve high conductivity and strength, coupled with an important value of durability. The Cu/Zn alloyed sputtering target is widely used in copper and zinc photovoltaics and zinc-copper alloys in semiconductor, material science, and thin film circuits.  

Powder metallurgy is the traditional method employed in the creation of Cu/Zn alloyed sputtering targets. In powder metallurgy, components, alloys of zinc and copper, are constructed through the alloying of copper and zinc powder, homogeneous mixing, and subsequent compaction. The compact is processed through powder metallurgy via sintering, and high-temperature formation is used to yield an ample, dense target material of uniformity. The target is then machined to the dimensions required for sputtering, and the excess material is removed, producing the target.

Properties Of Copper-Zinc Alloy Sputtering Target