This high-performance copper alloy sheet, specifically designed for VC vapour chamber heat sinks, utilises an ultra-pure oxygen-free copper substrate and micro-alloying technology to achieve an exceptional thermal conductivity of ≥ 400 W/m ·K. Precision-rolled to an ultra-thin thickness of 0.1-0.3mm, it combines excellent flatness with creep resistance. A special annealing process ensures the material maintains its structural stability under sustained high temperatures. At the same time, the capillary structure on the inner wall is formed into uniform microchannels through laser etching, enabling efficient circulation of the liquid working fluid. This copper alloy sheet has been widely used in the heat dissipation systems of 5G base station processors, ultra-thin laptops, and high-power LEDs, reducing core temperatures by 15-30℃ and providing reliable thermal management for electronic devices.

Features Of Copper Alloy VC Heat Spreader Sheet

Lightweight design improves system efficiency.

Compatible with a range of electronic components.

Easy installation with secure mounting options.

Durable construction for long-lasting performance.

Enhanced cooling for improved device reliability.