C19010 is an alloy characterized by precipitation hardening and is additionally known to attain a good balance between elevated strength and good electrical and thermal conductivity. C19010 (CuNiSiP) is one of the quality alloys used in the electronics industry. C19010 obtains strength from Ni−Si precipitates formed during the processes of cold working and heat treatment, while also providing excellent formability and bendability, and stable performance in stress relaxation (effective up to around 150 °C). The alloy`s good corrosion resistance includes an ability to resist stress corrosion cracking, while weldability, solderability, and brazability are also included as positive features of the alloy. The performance traits of the alloy are of a certain outstanding character, primarily due to the high electrical and thermal conductivity of copper, toughness and strength of nickel, heat resistance of silicon, and corrosion resistance of phosphorus.

Properties Of C19010 Copper Alloy Foil

Chemical Composition: Ni: 0.8%~1.8%/Si: 0.15%~0.35%/Cu: Remainder

Density: 8.91 g/cm³

Electrical conductivility: 53 IACS%(20°C)

Modulus of elasticity: 127 GPa

Coefficient of thermal expansion: 16.8 10-6/K

Thermal conductivity: 255 W/(m*K)

Tensile Strength(Mpa): 360 - 655

Yield Strength(Mpa):≥ 275 - 510

Elongation(%):≥ 6 - 12

Hardness(HV): 100 - 210